Lithography is at the heart of the semiconductor industry. Over the last 30 years, we have utilized our unique balance of experience and innovation to evolve with the needs of this growing industry and build a strong value-added business for all our stakeholders.
Technology is changing fast. Some 160 trillion gigabytes of data will be created annually by 2025.
While the world’s most advanced logic and memory chips are powering high-end trends in artificial intelligence, Big Data and automotive technology, the simpler, low-cost chips are integrating sensing capabilities in everyday technology to create a vast Internet of Things.
This translates into growth of worldwide fab capacity in all segments, especially at the leading-edge nodes. This provides a long-term growth opportunity for ASML as we continue to meet the semiconductor industry’s demand for higher productivity, lower cost, and simpler chip-making processes.
Based on different market scenarios, we have an opportunity to grow our annual revenue for 2025 to between €15 billion and €24 billion.
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But the industry needs the right tools in place to cost-effectively mass produce chip technology, especially as chip features continue to shrink.
The transition from Deep Ultraviolet (DUV) to Extreme Ultraviolet (EUV) light has simplified the chip manufacturing process and reduced costs across the board in comparison to complex multi-patterning processes.
ASML has pioneered EUV lithography. Thanks to the higher resolution our machines achieve, chipmakers can now produce smaller, faster and more powerful chips while keeping costs in check.
Moore to explore
ASML will continue to explore many other opportunities in a range of areas that provide unique value drivers for our customers and our businesses.
We have completed several strategic and focused mergers and acquisitions over the past years to further support our growth and technological advancement as a company.
In 2001, we acquired the Silicon Valley Group, whose site in Wilton, Connecticut, US, is now a major R&D and manufacturing center.
2013年，我们获得了Cymer, a US manufacturer of light sources, to accelerate the development of the next-generation lithography technology EUV.
201年6, we acquiredHMI.in Taiwan to further enhance our Holistic Lithography product portfolio with e-beam inspection technology.
201年7, we acquired a 24.9% indirect interest in Carl Zeiss SMT GmbH in Germany to facilitate the further development of our EUV systems and align both companies in executing long-term roadmaps, including High-NA.
In 2020, we acquired Berliner Glas Group, a privately held manufacturer of ceramic and optical modules, which are important to support the future roadmap for our EUV and DUV products.